UV laser marking machine
Laser marking machine uses a high-energy-density laser beam to locally irradiate the surface of the workpiece, causing the surface material to quickly vaporize or change color, thereby exposing the deeper material or causing chemical and physical changes in the surface material to leave traces, or burning part of the material through light energy to reveal the required etching graphics, text, etc.
Product features
Advantage
1. The UV laser marking machine inherits the advantages of previous generations of solid-state laser marking machines and has an ultra-high-speed marking method;
2. The machine is stable and reliable; the whole machine has low operation and maintenance costs and a wide range of applications;
3. It uses a high-precision 355nm end-pumped UV laser with high beam quality, small focused spot, perfect marking quality, and can achieve ultra-fine marking;
4. The heat-affected area of the mark is extremely small, which solves the problems of heat deformation and burning of processed materials. It is the preferred product for customers who have higher requirements for marking effects.
Features of UV laser marking machine:
1. UV laser is a cold light source, and the heat effect during laser cutting or marking is particularly small, which is more suitable for deep processing of materials that are sensitive to heat effects;
2. UV laser has a narrower pulse width and higher peak power, which can easily break through the damage threshold of materials with higher damage thresholds such as ceramic sapphire, so it is easy to process polymer materials with high damage threshold requirements;
3. The spot of UV laser after focusing can reach as small as 15UM, so it is very suitable for micro-hole drilling;
4. Ultra-high peak power and minimal thermal effect are very suitable for drilling and cutting of alumina and zirconia ceramics;
5. Free maintenance, no consumables, low cost of use, energy saving;
6. Integrated modular design, easy maintenance, compact size;
7. Environmentally friendly marking, ROHS compliant;
8. The software can receive DXF, PLT, BMF, AI, JPG and other formats, and can automatically generate serial numbers and production dates, barcodes, and QR codes.
Application
YSP-Z/3 purple laser marking machine is mainly used in fine cutting, scribing, marking and micro-machining of various materials; laser rapid prototyping; FPC board cutting; micro-hole drilling (aperture d≤10μm); flexible PCB board marking and scribing; metal or non-metallic coating removal; silicon wafer micro-hole; and blind hole processing.
Suitable processing materials: metal and various non-metallic materials, ceramics, sapphire sheets, glass, light-transmitting polymer materials, plastics.
Parameter
Power | 3W |
Laser Wavelength | 355nm |
Beam qualit | ㎡ <1.2 |
Marking Speed | ≤ 7000mm/s |
Working area | 110mm×110mm |
Minimum Line Width | 0.015mm |
Minimum Character | 0.01mm |
Repeatability | ±0.001mm |
Power consumption | 800W/1200W |
Voltage | AC220 50Hz 5A |
Cooling Type | water cooling |
service life | 12000-15000h |
UV laser marking machine
Laser marking machine uses a high-energy-density laser beam to locally irradiate the surface of the workpiece, causing the surface material to quickly vaporize or change color, thereby exposing the deeper material or causing chemical and physical changes in the surface material to leave traces, or burning part of the material through light energy to reveal the required etching graphics, text, etc.
Product features
Advantage
1. The UV laser marking machine inherits the advantages of previous generations of solid-state laser marking machines and has an ultra-high-speed marking method;
2. The machine is stable and reliable; the whole machine has low operation and maintenance costs and a wide range of applications;
3. It uses a high-precision 355nm end-pumped UV laser with high beam quality, small focused spot, perfect marking quality, and can achieve ultra-fine marking;
4. The heat-affected area of the mark is extremely small, which solves the problems of heat deformation and burning of processed materials. It is the preferred product for customers who have higher requirements for marking effects.
Features of UV laser marking machine:
1. UV laser is a cold light source, and the heat effect during laser cutting or marking is particularly small, which is more suitable for deep processing of materials that are sensitive to heat effects;
2. UV laser has a narrower pulse width and higher peak power, which can easily break through the damage threshold of materials with higher damage thresholds such as ceramic sapphire, so it is easy to process polymer materials with high damage threshold requirements;
3. The spot of UV laser after focusing can reach as small as 15UM, so it is very suitable for micro-hole drilling;
4. Ultra-high peak power and minimal thermal effect are very suitable for drilling and cutting of alumina and zirconia ceramics;
5. Free maintenance, no consumables, low cost of use, energy saving;
6. Integrated modular design, easy maintenance, compact size;
7. Environmentally friendly marking, ROHS compliant;
8. The software can receive DXF, PLT, BMF, AI, JPG and other formats, and can automatically generate serial numbers and production dates, barcodes, and QR codes.
Application
YSP-Z/3 purple laser marking machine is mainly used in fine cutting, scribing, marking and micro-machining of various materials; laser rapid prototyping; FPC board cutting; micro-hole drilling (aperture d≤10μm); flexible PCB board marking and scribing; metal or non-metallic coating removal; silicon wafer micro-hole; and blind hole processing.
Suitable processing materials: metal and various non-metallic materials, ceramics, sapphire sheets, glass, light-transmitting polymer materials, plastics.
Parameter
Power | 3W |
Laser Wavelength | 355nm |
Beam qualit | ㎡ <1.2 |
Marking Speed | ≤ 7000mm/s |
Working area | 110mm×110mm |
Minimum Line Width | 0.015mm |
Minimum Character | 0.01mm |
Repeatability | ±0.001mm |
Power consumption | 800W/1200W |
Voltage | AC220 50Hz 5A |
Cooling Type | water cooling |
service life | 12000-15000h |
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